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Maxim产品可靠性规范


Maxim Integrated Products 120 San Gabriel Drive Sunnyvale, CA 94086 Phone: 408-737-7600, FAX: 408-737-7194

Product Reliability Qualification Document ID: 10-3006, Rev. H

Maxim Integrated Products

Effective: 6/27/01

TABLE OF CONTENTS PURPOSE............................................................................................................................................................. 3 SCOPE .................................................................................................................................................................. 3 TERMS AND DEFINITIONS .............................................................................................................................. 3 APPLICABLE DOCUMENTS............................................................................................................................ 3 EQUIPMENT AND MATERIALS....................................................................................................................... 3 GENERAL REQUIREMENTS ........................................................................................................................... 3
QUALIFICATION PROGRAM REQUEST: ........................................................................................................................................................... 3 QUALIFICATION PLAN:.......................................................................................................................................................................................... 3 QUALIFICATION SAMPLES:................................................................................................................................................................................. 3 PRODUCT RELIABILITY MONITOR PROGRAM:............................................................................................................................................ 6

ACCEPTANCE .................................................................................................................................................... 6 DISPOSITION OF MATERIAL ........................................................................................................................... 6 DATA RECORDING............................................................................................................................................ 6 MAINTENANCE................................................................................................................................................... 6 APPENDICES ...................................................................................................................................................... 6
12.1. RELIABILITY QUALIFICATION REQUIREMENTS FOR IC'S IN PLASTIC PACKAGES .............................................................. 7 12.2. RELIABILITY QUALIFICATION REQUIREMENTS FOR IC'S IN HERMETIC PACKAGES ........................................................... 9 12.3. RELIABILITY QUALIFICATION GUIDELINE FOR NEW PRODUCT/ FAB PROCESS/ PACKAGE..........................................11 12.4. GUIDELINE FOR QUALIFICATION TEST MATRIX FOR MAJOR CHANGES ...............................................................................12 12.5. PRODUCT RELIABILITY MONITOR PROGRAM.................................................................................................................................13 12.5.1 LONG TERM RELIABILITY MONITOR .................................................................................................................................................13 12.5.2 SHORT TERM RELIABILITY MONITOR...............................................................................................................................................13

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 1 OF 12

1. 2.

TITLE: [HQ/EV][GEN] Product Reliability Qualification PURPOSE:
2.1. This specification establishes reliability qualification requirements for all Maxim IC devices.

3.

SCOPE:
3.1. This specification applies to all IC devices manufactured by Maxim and Maxim's contractors. This includes all new products, fab processes, packages and major engineering changes on existing products.

4.

TERMS AND DEFINITIONS:
4.1. It is the responsibility of the reliability group to carry out the qualification program with help from design, testing, packaging and production groups to make the qualification program successful.

5.

APPLICABLE DOCUMENTS:
5.1. 5.2. 5.3. Mil-STD-883C - Test Methods and Procedures for Microelectronics Mil-M-38510 - General Specification for Microcircuits JEDEC Standard No.22A - Test Methods and Procedures for Solid State Devices used in Transportation/Automotive Applications

6.

EQUIPMENT AND MATERIALS:
6.1. As specified per test requirements.

7.

GENERAL REQUIREMENTS:
7.1. QUALIFICATION PROGRAM REQUEST: 7.1.1. A written description by the submitting group of what is to be qualified shall be forwarded to Rel Department. The submission of qualification samples could be from Design, Process, Assembly/Packaging, or initiated by Reliability Group.

7.2.

QUALIFICATION PLAN: 7.2.1. Upon receipt of the qualification request, Rel group shall publish a qualification plan that details: 7.2.1.1. Reliability testing required 7.2.1.2. Test condition and test duration 7.2.1.3. Sampling plan 7.2.1.4. Qualification schedule 7.2.1.5. Burn-in circuit and 85/85 test circuit if needed

7.3.

QUALIFICATION SAMPLES: 7.3.1. 7.3.2. 7.3.3. It is the responsibility of submitting group to provide fully electrical tested (QA room) samples to the Rel group. This can be coordinated through the Product Line Managers (PLM). For Major quals, 3 distinct lots are required. For Minor quals, 1 lot is required. A control lot from existing qualified fab process or assembly process must be supplied along with the qualification samples, so that both groups may run in parallel through the qualification testing if necessary.

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 2 OF 12

7.4.

QUALIFICATION TEST: 7.4.1. Reliability Requirements: 7.4.1.1. Appendix 12.1 and 12.2. list standard qualification tests for plastic and hermetic packages. All plastic products shall be designed to survive the tests specified in Appendix 12.1. All hermetic products shall be designed to survive the tests specified in Appendix 12.2. It is not necessary that all tests must be performed for a product/process/package qualification. Only the relevant tests will be selected per the predefined qualification plan by the Rel group. 7.4.1.2. The exact qualification requirements will be governed by the qualification plan. 7.4.1.3. Qualification by Similarity may be granted upon the discretion of the Reliability Director based upon past reliability information on closely similar packages, processes, or products. 7.4.1.4. Once qualified, a die type is considered qualified by extension to any other qualified package. 7.4.1.5. Once a core die type is fully qualified, only ESD and Latchup are required to extend qualification to die produced with other metal options. 7.4.2. Sampling Plan: 7.4.2.1. The number of samples required for qualification is defined in Appendix 12.1 and 12.2. The accept/reject criteria are also listed in Appendix 12.1 and 12.2. The sample size of the tests may be adjusted if necessary per the LTPD sampling plan. 7.4.3. Failure Definitions: 7.4.3.1. Devices which fail to meet endpoint inspection criteria shall be considered rejects. These endpoint inspections include electrical test, visual inspection, mechanical stress test, hermeticity test, destructive and non-destructive tests. 7.4.4. Special Customer Requirements: 7.4.4.1. In the event customer's requirements are more stringent than Appendix 12.1 and 12.2, the customer's requirements, as set forth in the special spec shall be followed. 7.4.5. Pre-conditioning Requirements for Surface Mount Packages: 7.4.5.1. Plastic packages in surface mount forms should be subjected to preconditioning prior to the start of the following reliability tests: 85/ 85, HAST, and temperature cycling. 7.4.5.2. Surface Mount Packages should be subjected to: 7.4.5.2.1. 85 C/85 % R.H. environment with no bias for 168 hours. 7.4.5.2.2. Follows by 3 insertions through Infrared Reflow peak temperature 240 +/- 5C/120180 sec over 183 C. 7.4.5.3. Electrical Test Verification: 7.4.5.3.1. Following the preconditioning test, all test samples should be electrically tested per data sheet specification. 7.4.6. Duration of Reliability Test: 7.4.6.1. For qualification purpose, each reliability test duration should follow the requirements specified in Appendix 12.1 and 12.2. Reliability stress testing should be extended to longer duration in order to determine process, package margin to the stated reliability performance.

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 3 OF 12

7.4.6.2. Conditional qualification may be granted after passing 500 hours BI, 85/85 500 hours (or HAST 100 hours). Pressure Pot 168 hours, Temp. cycle 500 cycles. before 1000 hours (or 1000 cycles) is completed. However, if the 1000 hour data fails the qual, customer shall be notified of qual results. 7.5. New Product/New Fab Process/New Package Qualification: 7.5.1. For the qualification of new fab process or new package or new assembly process, three manufacturing runs must satisfactorily meet the qualification requirements as defined in the qual plan. New products will be released for sampling or pre-production orders prior to the completion of the qualification plan. The qualification period will not extend longer than 90 days. The qualification results will then determine the status of continued production. A new product, developed on an existing qualified process must complete successfully a life test monitor, prior to release for shipment. After three months, the product must demonstrate that its reliability performance meets Maxim's standard as outlined in Appendix 12.3 for new product qualification. If it does not, the product will be put on hold until an action plan is formulated and implemented to meet this goal. It is the responsibility of the Reliability Manager to govern and enforce this policy. Qualifying product by similarity: The same die type does not need to be qualified in each available package/product configuration provided that (1) the die type has been successfully qualified in at least one package type, and (2) the same die type (process and function) has been qualified earlier in the intended package.

7.5.2.

7.5.3.

7.6.

Major Engineering Changes: 7.6.1. Major engineering changes are changes to the products that have the potential to adversely affecting product reliability. Examples of major engineering changes include the following: 7.6.1.1. Mask change or redesign 7.6.1.2. Metallization changes 7.6.1.3. Passivation or Dielectric changes 7.6.1.4. Major fab process changes 7.6.1.5. Packages changes 7.6.1.6. Molding compound changes 7.6.1.7. Wire bonding changes 7.6.1.8. Die attach changes 7.6.1.9. End of Line changes - deflash or plating method 7.6.2. 7.6.3. All these changes require product requalification and customer change notification. Appendix 12.4 lists a guideline for qualification test matrix for major changes.

7.7.

Burn-in Requirements: 7.7.1. Burn-in Evaluation for Qualification: 7.7.1.1. For each qualification test that requires a life test, a burn-in evaluation must be included to analyze the infant mortality of the process/product.

7.8.

Failure Analysis of Qualification Failures: 7.8.1. It is the responsibility of FA Engineering to analyze qualification rejects and issue an IFAR report in a timely manner so the cause of reject can be corrected.

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 4 OF 12

7.9.

Reliability Qualification Report: 7.9.1. 7.9.2. 7.9.3. At the conclusion of the qualification effort, Rel engineering shall issue a reliability report to the appropriate groups. All qualification reports will be submitted in electronic format for routing and approval. Approval shall include the originator, appropriate Rel Manager/Director, and the Executive Director of QA. Approved electronic reports will be converted to PDF format and filed as defined by Reliability department (current location = “Huey\Public2\Prodcntl\RelProj\PDF_RRPT\report file name”).

7.10.

PRODUCT RELIABILITY MONITOR PROGRAM 7.10.1. Once a product is qualified, the product will be in the monitor program. The product monitor lot selection shall be grouped by fab/process combination determined by QA and product groups. 7.10.2. Once per week, 80 units from a product representative of each major semiconductor process (i.e. S3, S5, etc.) shall have a life test (135°C/192 hours) and Pressure Pot 168 hours performed as a weekly monitor. 7.10.3. Once a quarter, a 1000 hours life test (15o3C), a 1000 hours storage life test (150oC), a 1000 hours 85/85 test, and a 1000 cycles temperature cycle test, per Appendix 12.5, shall be performed to monitor each fab/process group. 7.10.4. The reliability monitor programs will be performed dependent upon availability of samples. In a monitor period where suitable samples are unavailable, the monitor interval will be skipped.

8. 9. 10.

ACCEPTANCE: DISPOSITION OF MATERIAL: DATA RECORDING:
10.1.

N/A N/A

All qualification samples and records shall be retained by the Rel Group for 5 years.

11. 12.

MAINTENANCE: APPENDICES:

N/A

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 5 OF 12

12.1.

RELIABILITY QUALIFICATION REQUIREMENTS FOR IC'S IN PLASTIC PACKAGES

STRESS TEST NAME

CONDITION

SAMPLING PLAN SS / Acc or LTPD
77 / 1 5%

END POINTS

Life Test, Dynamic preferable

135°C/ 1000 hrs with virgin production units only extend to 2000 hrs for information only 850C/85% RH, 1000 hrs extend to 2000 hrs for information only (note 1) 121oC / 15 psig 168 hrs (note 3) 130°C / 85% RH 100 hrs (note 1) -65oC to 150oC 1000 X (note 1) Extended to 2000 X. For information only. (note 1) 1500C/ 1000 hrs extend to 2000 hrs for information only Human body model 1.5K ohm 100pF cap 2000V or actual Voltage + / -200 mA or actual rating, using 1.5X VCC or absolute max ratings. Power On and off to cycle Tj between ambient and 1500C. 10k cycles minimum. 260oC / 10 sec solder dip 300oC / 10 seconds 20 samples minimum pull all wires 5 grams minimum

Electrical

85/85 Temperature & Humidity Bias (THB) (Note 5) Pressure Pot (Autoclave) HAST (Note 5) Temperature Cycle

77 / 1

5%

Electrical

77 / 0 45 / 0 77 / 1

3% 5% 5%

Electrical Electrical Electrical

High Temperature Storage ESD

77 / 1

5%

Electrical

5/0

Electrical

Latch-up

5/0

Electrical: requires post Latchup ATE tests 5% Electrical

Power Cycle

45/0

Solder Shock Resist to Soldering Heat Wire Bond Pull

15 / 0 15 / 0 20/0

15% 15%

Electrical Electrical accept no bond crater or oxide crack

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 6 OF 12

STRESS TEST NAME

CONDITION

SAMPLING PLAN SS / Acc or LTPD
150/0 20/0 5/0 15 / 0 15 / 0 15 / 0 15 / 0 15 / 0 15 / 0 15 / 0 15 / 0 15% 15% 15 % 15% 15% 15% 15% 15%

END POINTS

Bond Crater Check

bake 125 C/24 hrs +IR Reflow +bond crater check per Mil spec 883 method 2019.5 per drawing >3 90 degree bends 8 oz weight / 30 sec minimum 8 hrs steam aging

Die Shear Physical Dimensions Lead Fatigue Tensile Strength Solderability Resistance to Solvents Adhesion of Lead Finish Salt Atmosphere External Visual Plating Thickness

Post IR QA hot & room test Bond Crater & Visual test accept no crater or oxide crack Must be provided by Assembly group Visual Visual Visual Visual Visual Visual Visual Visual

200u - inch min- Solder dip 300u- inch min- Solder plating 85C/85% RH soak 168 hrs +Infrared 240+/-5C peak 120-180 sec over 183C +SAM +Bond crater check

10 / 0

Infrared Solder Reflow

150/0 20/0 20/0

hot & room test evaluate pkg delam accept no bond crater or oxide crack Electrical

Moisture Torture Test (Note 4)

85/85 168 hours (no bias) + solder dip 2600C/ 5 seconds, 3 times. + pressure pot 96 hours

20 / 0

NOTE:
1. 2. 3. 4. 5. Preconditioning is required for these tests per section 7.4.5 requirements. High power devices only/ Preconditioning not required for Pressure Pot. Information only, not required for qualification. Either HAST or 85/85 may be chosen.

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 7 OF 12

12.2.

RELIABILITY QUALIFICATION REQUIREMENTS FOR IC'S IN HERMETIC PACKAGES

STRESS TEST NAME

CONDITION
1350C/ 1000 hrs extend to 2000 hours for information only -650C to +1500C/1000X extend to 2000 X for information only 0oC to +100oC 200 cycles 150oC/1000 hours Extend to 2000 hrs for information only Human body model 2000V or actual Voltage +/-200 mA or actual rating, using 1.5x Vcc or absolute max ratings 260oC/10 seconds solder dip 300oC/ 10 seconds 5 grams minimum per Mil 883 method 2019.5 Per drawing >3 90 degree bends 8 oz weight/30 seconds minimum 8 hours steam aging

SAMPLING PLAN SS / Acc or LTPD
77 / 1 5%

END POINTS

Life Test, Dynamic

Electrical

Temperature Cycle

77 / 1

5%

Electrical + Seal Electrical + Seal Electrical

Thermal Shock High Temperature Storage ESD Latch-up

77 / 1 77 / 1

5% 5%

5/0 5/0

Electrical Electrical

Solder Shock Resist to Soldering Heat Wire Bond Pull Die Shear Physical Dimensions Lead Fatigue Tensile Strength Solderability

15 / 0 15 / 0 45 / 0 5/0 15 / 0 15 / 0 15 / 0 15 / 0

15% 15% 5%

Electrical + Seal Electrical

15% 15% 15% 15%

Visual Visual Visual Visual

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 8 OF 12

STRESS TEST NAME

CONDITION

SAMPLING PLAN SS / Acc or LTPD
15 / 0 15% 5%

END POINTS

Resistance to Solvents Power Cycle Power On and Off to cycle Tj between ambient and 1500C 10K cycles minimum

Visual Electrical

45 / 0

Salt Atmosphere RGA, Moisture Content Mechanical Shock Plating Thickness 200 u - inch min- Solder dip 300u- inch min Solder plating < 5000 PPM H2O

15 / 0 3/0 15 / 0 10 / 0

15%

Visual

15%

Electrical + Seal

Lid Torque Adhesion of Lead Finish External Visual Mil-Std-883, D-3 Thermal Sequence Thermal shock Temp cycle Moisture resistance Fine/Gross leak Visual Electrical

5/0 15 / 0 15 / 0 15% 15%

Visual Visual Visual

o o -55 C to +125 C, 15X o o -65 C to +150 C, 100X

45/0

5%

Seal + Visual + Electrical

Mil-Std-883, D-4 Mechanical Sequence Mechanical shock Vibration Const acceleration Fine/Gross leak Visual Electrical

45 / 0 Cond B Cond A Cond E

5%

Seal + Visual + Electrical

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 9 OF 12

12.3.

RELIABILITY QUALIFICATION GUIDELINE FOR NEW PRODUCT/ FAB PROCESS/ PACKAGE

TEST NAME

NEW PRODUCT TEST CONDITION SAMPLING PLAN
77 / 1

NEW FAB PROCESS TEST CONDITION
135oC/1000 hrs 1000 hrs 168 hrs 1000 X 100 hrs

SAMPLING PLAN
77 / 1 77 / 1 77 / 0 77 / 1 45 / 0

NEW PACKAGE/ ASSEMBLY PROCESS TEST SAMPLING CONDITION PLAN
135oC/1000 hrs 1000 hrs 168 hrs 1000 X 100 hrs 77 / 1 77 / 1 77 / 0 77 / 1 45 / 0

Life Test 85 / 85 Test

135oC/192 hrs *2

*1 *1

Pressure Pot

Temp Cycle -65 to +150oC HAST *1 130°C/85% R.H. ESD Latch-up Bondwire Pull Bond Crater Check YES YES

Yes Yes

20/0 20/0

Yes Yes

20/0 20/0

*1 Plastic packages only
*2 Standard Burn In temperature is Ta = 1350C. Other temperatures and durations may be substituted for products with high power dissipation, or with component limitation to high temperature performance.

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 10 OF 12

12.4.

GUIDELINE FOR QUALIFICATION TEST MATRIX FOR MAJOR CHANGES
New Fab Location Life Test 85/85 New Fab Process Passivation Metal Dielectric Starting Wafer New Assembly New Package Plastic Molding Compound Die Attach Wire Bond Die coating Lead Finish

Pressure Pot Temp. Cycle High Temp. Storage Hast *1 Power Cycle ESD Latch-Up Solder Reflow Solderability Resist to Solvents Solder Shock Wire Bond Pull Bond Crater Check Shock, Vibration Centrifuge *3

X X X X X X X*2 X X

X X X X X X X*2 X X

X X X X X X

X X X X X X X*2

X X X X

X

X X X X X X X*2

X X X X X X X2

X X X X X X

X X X X

X

X X

X X X X X X

X X

X X X

X X*2

X

X

X X X X X X X X

X X X X X X X

X

X

X

X X

X X X X X X X X X X X X X X

X X

X X

X X

Note: X = Mandatory *1 = Optional *2 = Power devices only *3 = Hermetic only

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 11 OF 12

12.5.

PRODUCT RELIABILITY MONITOR PROGRAM 12.5.1. LONG TERM RELIABILITY MONITOR

TEST

TEST CONDITIONS

SAMPLING PLAN SS/Acc

FREQUENCY

Life Test

135°C/1000 hrs

77/1

per quarter

85 / 85 Test

1000 hrs

77 / 1

per quarter

Pressure Pot

168 hrs

77/0

per quarter

Temp Cycle

1000 cycles

77 / 1

per quarter

High Temp Storage Life

150°C/1000 hrs

77 / 1

per quarter

12.5.2. SHORT TERM RELIABILITY MONITOR

TEST

TEST CONDITIONS

SAMPLING PLAN SS/Acc

FREQUENCY

Life Test

135°C/192 hrs

77/1

per week

Pressure Pot

168 hrs

77/0

per week

MAXIM

TITLE: [HQ/EV][GEN] Product Reliability Qualification DOCUMENT I.D. 10-3006 REVISION H PAGE 12 OF 12


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